AEC - Q200 - Rev E
March 20, 2023
STRESS TEST
QUALIFICATION FOR
PASSIVE COMPONENTS
Component Technical Committee
Automotive Electronics Council
AEC - Q200 - Rev E
March 20, 2023
Component Technical Committee
Automotive Electronics Council
TABLE OF CONTENTS
1.
SCOPE .................................................................................................................................................. 1
1.1.
Description ...................................................................................................................................... 1
1.2.
Purpose ........................................................................................................................................... 1
1.3.
Reference Documents ..................................................................................................................... 1
1.4.
Abbreviations .................................................................................................................................. 2
1.5.
Definitions ....................................................................................................................................... 2
1.5.1.
AEC-Q200 Qualification ......................................................................................................... 2
1.5.2.
AEC Certification .................................................................................................................... 2
1.5.3.
Temperature Ranges .............................................................................................................. 2
1.5.4.
Approval for Use in an Application ........................................................................................ 3
1.5.5.
Most Sensitive Component .................................................................................................... 3
1.5.6.
Generic Data ........................................................................................................................... 3
2.
GENERAL REQUIREMENTS ................................................................................................................ 3
2.1.
Objective .......................................................................................................................................... 3
2.2.
Precedence of Requirements .......................................................................................................... 3
2.3.
Use of Generic Data ......................................................................................................................... 3
2.4.
Test Samples ................................................................................................................................... 4
2.4.1.
Lot Requirements ................................................................................................................... 4
2.4.2.
Production Requirements ...................................................................................................... 4
2.4.3.
Reusability of Test Samples .................................................................................................. 4
2.4.4.
Sample Size Requirements .................................................................................................... 4
2.4.5.
Pre-stress and Post-stress Test Requirements ..................................................................... 4
Figure 1: Pre and Post Stress Test Block Diagram ............................................................................................................... 5
2.4.6.
Test Failure After Stressing ................................................................................................... 5
2.4.7.
Criteria for Passing Qualification ........................................................................................... 5
2.4.8.
Alternative Requirements ...................................................................................................... 5
3.
QUALIFICATION AND REQUALIFICATION ............................................................................................. 6
3.1.
Qualification of a New Component ................................................................................................. 6
3.2.
Qualification of Surface Mounted Device (SMD) Components ........................................................................ 6
Table A: Temperature Grades...................................................................................................................... 6
Table B: Stress Tests Requiring Reflow Passes ..........................................................................................7
Figure 2: Overall Process for SMD Lead-free Components ................................................................................................. 7
3.3.
Requalification of a Component ..................................................................................................... 7
3.3.1.
Process Change Notification (PCN) ...................................................................................... 7
3.3.2.
Changes Requiring Requalification ....................................................................................... 8
3.3.3.
Changes Requiring Requalification ....................................................................................... 8
3.3.4.
Criteria for Passing Requalification ....................................................................................... 8
3.3.5.
User Approval ........................................................................................................................ 8
AEC - Q200 - Rev E
March 20, 2023
Component Technical Committee
Automotive Electronics Council
TABLE OF CONTENTS (continued)
4.
QUALIFICATION TESTS .......................................................................................................................... 9
4.1.
General Tests ................................................................................................................................... 9
4.2.
Data Submission Format ................................................................................................................. 9
Table C: Reflow Passes for High Volume Components............................................................................. 10
Table D: Qualification Sample Size ............................................................................................................. 12
Table 1: Stress Qualifications for Tantalum (MnO
2
and Polymer) and Niobium Capacitors.................... 14
Table 1A: Tantalum (MnO2 and Polymer) and Niobium Capacitors Process Change Qualification
Guidelines for the Selection of Tests .................................................................................................... 17
Table 1B: Tantalum (MnO2 and Polymer) and Niobium Capacitors Acceptance Criteria .................... 18
Table 2: Stress Qualifications for Ceramic Capacitors ............................................................................. 19
Table 2A: Ceramic Capacitors Process Change Qualification Guidelines for the Selection of Tests 22
Table 2B-1: Ceramic Capacitors - Class I SMD Acceptance Criteria ................................................... 23
Table 2B-2: Ceramic Capacitors - Class II/III SMD Acceptance Criteria .............................................. 24
Table 3: Stress Qualifications for Aluminum Electrolytic (Hybrid, Polymer and Standard) Capacitors . 25
Table 3A: Aluminum Electrolytic (Hybrid, Polymer and Standard) Capacitors Process Change
Qualification Guidelines for the Selection of Tests .............................................................................. 29
Table 4: Stress Qualifications for Film Capacitors ................................................................................... 30
Table 4A: Film Capacitors Process Change Qualification Guidelines for the Selection of Tests ...... 34
Table 5: Stress Qualifications for Magnetics (Inductors/Transformers) .................................................. 35
Table 5A: Magnetics (Inductors/Transformers) Process Change Qualification Guidelines for the
Selection of Tests.................................................................................................................................. 38
Table 6: Stress Qualifications for Networks (R-C/C/R) ............................................................................. 39
Table 6A: Networks (R-C/C/R) Process Change Qualification Guidelines for the Selection of Tests 43
Table 7: Stress Qualifications for Resistors ............................................................................................. 44
Table 7A: Resistors Process Change Qualification Guidelines for the Selection of Tests................ 48
Table 7B-1: Acceptance Criteria for Carbon Film THT Fixed Resistors .............................................. 49
Table 7B-2: Acceptance Criteria for Metal Film THT Fixed Resistors (Includes molded flat lead SMD)
............................................................................................................................................................... 50
Table 7B-3: Acceptance Criteria for Metal Oxide THT Fixed Resistors ............................................... 51
Table 7B-4: Acceptance Criteria for Wire Wound THT Fixed Resistors (Includes molded flat lead
SMD) ...................................................................................................................................................... 52
Table 7B-5: Acceptance Criteria for SMD chip resistors (Does not include molded flat lead SMD, but
does include coated metal strip) .......................................................................................................... 53
Table 8: Stress Qualifications for Thermistors (NTC, Platinum, Ceramic PTC) ...................................... 54
Table 8A: Thermistors (NTC, Platinum, Ceramic PTC) Process Change Qualification Guidelines for
the Selection of Tests ......................................................................................................................................................................................... 58
AEC - Q200 - Rev E
March 20, 2023
Component Technical Committee
Automotive Electronics Council
TABLE OF CONTENTS (continued)
Table 9: Stress Qualifications for Trimmer Capacitors/Resistors ............................................................ 59
Table 9A: Trimmer Capacitors/Resistors Process Change Qualification Guidelines for the Selection
of Tests ................................................................................................................................................. 63
Table 10: Stress Qualifications for Varistors ............................................................................................ 64
Table 10A: Varistors Process Change Qualification Guidelines for the Selection of Tests ............... 68
Table 11: Stress Qualifications for Quartz Crystals .................................................................................. 69
Table 11A: Quartz Crystals Process Change Qualification Guidelines for the Selection of Tests .... 73
Table 12: Stress Qualifications for Ceramic Resonators .......................................................................... 74
Table 12A: Ceramic Resonators Process Change Qualification Guidelines for the Selection of Tests
............................................................................................................................................................... 77
Table 13: Stress Qualifications for Ferrite EMI Suppressors/Filters ........................................................ 78
Table 13A: Ferrite EMI Suppressors/Filters Process Change Qualification Guidelines for the
Selection of Tests.................................................................................................................................. 82
Table 14: Stress Qualifications for Polymeric Resettable Fuses ............................................................. 83
Table 14A: Polymeric Resettable Fuses Process Change Qualification Guidelines for the Selection
of Tests ................................................................................................................................................. 87
Table 15: Stress Qualifications for Fuses ................................................................................................. 88
Table 15A: Fuses Process Change Qualification Guidelines for the Selection of Tests .................... 93
Table 16: Stress Qualifications for Super Capacitors ............................................................................... 94
Table 16A: Super Capacitors Process Change Qualification Guidelines for the Selection of Tests .. 98
APPENDIX 1: Qualification Family ............................................................................................................ 99
APPENDIX 2: Certificate of Design and Construction (CDC) .................................................................. 100
APPENDIX 3: Qualification Test Plan Format ......................................................................................... 101
Figure 3: Example of Passive Component Qualification Plan ......................................................................................... 102
APPENDIX 4: Data Presentation Format and Content ............................................................................ 103
Figure 4: Environmental Test Summary ............................................................................................................................. 103
Figure 5: Parametric Verification Summary ........................................................................................................................ 104
Revision History....................................................................................................................................... 105
AEC - Q200 - Rev E
March 20, 2023
Component Technical Committee
Automotive Electronics Council
Acknowledgement
Any Document involving a complex technology brings together experience and skills from many sources. The
Automotive Electronics Council would especially like to recognize the following significant contributors to the
revision of this document:
AEC Q200 Sub-Committee Members:
Jenny Du
BorgWarner
Dominick DeMartino
Bose Corporation
Joseph Petitti
Coilcraft Inc.
Henning Zander
Continental Automotive Technologies GmbH
Keith Edwards
Diodes Inc.
Steven Sibrel
Harman International Group
Robert Kinyanjui
John Deere
Saad Lambaz [Sub-Committee Chair]
Littelfuse Inc.
Andrea Cantalupi
Marelli
Christian Merkel
Murata Manufacturing Co. Ltd.
Alex Yanez
Murata Manufacturing Co. Ltd.
Peter Turlo
onsemi
Andrea Wolf
Robert Bosch GmbH
Rolf Nussbaumer
Schurter AG
Michael Cannon
TDK Corporation
Christoph Raible
TDK Electronics AG
Ralf Schiffel
TDK Electronics AG
Heinz Strallhofer
TDK Electronics GmbH & Co OG
Ildikó Száraz
TDK Hungary Components Kft.
Darin Glenn
Vishay Intertechnology, Inc.
Breno Albuquerque
Vishay Intertechnology, Inc.
Andreas Seemayer
Vishay Electronic GmbH
LeAnna Weakley
Yageo Group
Alfred Chen
Yageo Group
Larry Dudley
ZF
This document is dedicated in memoriam to:
Bob Knoell (1957-2018)
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