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Qualcomm Adreno, Qualcomm RF360, Fluence, MSM, Qualcomm Hexagon, and Qualcomm Snapdragon are products of Qualcomm Technologies, Inc.
Qualcomm IZat is a product of Qualcomm Atheros, Inc. Other Qualcomm products referenced herein are products of Qualcomm Technologies, Inc. or its
subsidiaries.
© 2015-2016 Qualcomm Technologies, Inc. All rights reserved.
MSM8953
Device Specification
80-P2472-1 Rev. E
Qualcomm Technologies, Inc.
Device description
The MSM™ device uses the advanced 14 nm FinFET
process for lower active power dissipation and faster peak
CPU performance. It includes a customized 64-bit ARM
Cortex A-53 octa-core applications processor
non-package-on-package (non-PoP) LPDDR3 SDRAM
memory.
The latest air interface standards are supported, including:
LTE up to Cat 7 (FDD and TDD), including 2 × 20 CA
WCDMA up to Rel-10 HSPA+, including 4C-HSDPA+
and HSPDA 2 + 1 CA
TD-SCDMA up to DC-HSPA+ 64 QAM
GSM, GPRS, EDGE
CDMA up to 1X Advanced and 1xEV-DOrB
Key processor and memory characteristics include:
Customized octa-core applications processor
Eight high performance (target 2.0 GHz).
Qualcomm
®
Adreno™ 506 graphics processing unit
(GPU) with 64-bit addressing; designed for 650 MHz
Key features (see Section 1.2 for details)
Advanced RF techniques with WTR2965
Downlink carrier aggregation (DL-CA)
Uplink carrier aggregation (UL-CA)
Two 4-lane DSI D-PHY 1.1, FHD (1920 × 1200) 60 fps
Video 4k at 30 fps, 1080p at 60 fps, 2560 buffer width
(10 layers blending), VESA DSC 1.1 Adreno GPU with
UBWC
Three 4-lane CSI (4 + 4 + 4) D-PHY 1.2 at 2.1 Gbps per
lane
Dual 14-bit image signal processing (ISP): 13 MP and
13 MP; 24 MP at 30 fps ZSL with dual-ISP; 13 MP
30 ZSL with single-ISP
Support for USB 3.0, eMMC 5.1, and SD 3.0
Low-power Qualcomm sensor core with Q6 to support
always-on use cases
WLAN 802.11 b/g/n/ac, DBS, Bluetooth 4.1, and FM with
WCN3615, WCN3660B, and WCN3680B
Non-PoP high-speed memory, LPDDR3 SDRAM
designed for 933 MHz clock
MSM8953 high-level block diagram and 857 NSP package drawing
Audio
dsc
NFC
(optional)
dsc
I2C
Application-specific RFFE
MIPI_RFFEs & dsc
RFIC(s)
Memory support
Processors
Multimedia
MSM895 3
Internal functions
Clock circuits
JTAG
debug
4-ln MIPI_CSI
4-ln MIPI_CSI
Front
Connectivity SDC1
EBI 1
WLAN DAC & ADC
SD/
MMC
Connectivity
SDC2
3.0 USB w/ PHY
Bus interfaces
Discrete stat & ctl
Tx DACs
Rx front ends
Chipset &
RFFE I/Fs
UI M2
LPDDR3
SDRAM
eMMC
UI M1
4-ln MIPI_DSI
Keypad buttons
Accelerometer
Geomagnetic
Gyr os
Peripherals
/ sensors
Ambient li ght
Haptics
Near field comm
Press ure
Proxi mit y
Temperature
SPI
I2C
Flash
Displ ay
Rear
cxo
Dual-voltage UIM (x2)
PDM (audio)
I2C
UART
SPI
BLSP (x8)
MI PI _RF FEs
dsc
Wireless Conn
dsc
BT & FM SSBIs
WLAN command
WLAN Rx /Tx
SPMI
dsc
Power Management
Audio PDM
I2C
CCI (I2C + timing)
MIPI SLIMbus
Octa Cortex A53 P
LPA QDSP6
Modem QDSP6
RPM Cortex M3 P
Air Interfaces
GSM
CDMA
WC DMA
TD-SCDMA
LTE
GNSS
WCN
MI 2S
SS
Dept h
4-ln MIPI_CSI
4-ln MIPI_DSI
Bridge
Ext Display
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