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1. W25Q80 (8M-bit)、W25Q16 (16M-bit)和W25Q32 (32M-bit)串行闪存为空间、引脚和电源有限的系统提供了存储解决方案。25Q系列提供的灵活性和性能远远超过普通的串行闪存设备。他们是理想的代码隐藏到RAM,执行代码直接从双/四SPI (XIP)和存储声音,文本和数据。设备运行在单一2.7V至3.6V的电源上,电流消耗低至5mA有源,断电1a。所有的设备都提供节省空间的包装。W25Q80/16/32数组被组织成4,096/8,192/16,384个可编程页,每个页有256个字节。多达256字节可以被编程一次使用页程序指令。页面可以按16组(扇区擦除)、128组(32KB块擦除)、256组(64KB块擦除)或整个芯片(芯片擦除)擦除。W25Q80/16/32分别有256/512/1024个可擦除扇区和16/32/64个可擦除块。小的4KB扇区为需要数据和参数存储的应用程序提供了更大的灵活性。(见图2)。W25Q80/16/32支持标准串行外围接口(SPI),和高性能双/四输出以及双/四I/O SPI使用SPI引脚:串行时钟,芯片选择,串行数据I/O0 (DI), I/O1 (DO), I/O2 (/WP),和I/O3 (/HOLD)。SPI时钟频率高达80MHz的支持允许等效时钟率160MHz的双输出和320MHz的四次输出时,使用快速读双/四次输出指令。这些传输速率可与8位和16位并行闪存存储器相媲美。一个保持针,写保护针和可编程写保护,顶部或底部阵列控制,提供进一步的控制灵活性。此外,该设备支持JEDEC标准制造商和设备识别64位唯一序列号。
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W25Q80, W25Q16, W25Q32
Publication Release Date: September 26, 2007
- 1 - Preliminary - Revision B
8M-BIT, 16M-BIT AND 32M-BIT
SERIAL FLASH MEMORY WITH
DUAL AND QUAD SPI
W25Q80, W25Q16, W25Q32
- 2 -
Table of Contents
1. GENERAL DESCRIPTION ......................................................................................................... 5
2. FEATURES ................................................................................................................................. 5
3. PIN CONFIGURATION SOIC 208-MIL....................................................................................... 6
4. PAD CONFIGURATION WSON 6X5-MM .................................................................................. 6
5. PIN DESCRIPTION SOIC 208-MIL, AND WSON 6X5-MM........................................................ 6
6. PIN CONFIGURATION SOIC 300-MIL....................................................................................... 7
7. PIN DESCRIPTION SOIC 300-MIL ............................................................................................ 7
7.1 Package Types ............................................................................................................... 8
7.2 Chip Select (/CS) ............................................................................................................ 8
7.3 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .............................. 8
7.4 Write Protect (/WP)......................................................................................................... 8
7.5 HOLD (/HOLD) ............................................................................................................... 8
7.6 Serial Clock (CLK) .......................................................................................................... 8
8. BLOCK DIAGRAM ...................................................................................................................... 9
9. FUNCTIONAL DESCRIPTION ................................................................................................. 10
9.1 SPI OPERATIONS ....................................................................................................... 10
9.1.1 Standard SPI Instructions...............................................................................................10
9.1.2 Dual SPI Instructions......................................................................................................10
9.1.3 Quad SPI Instructions.....................................................................................................10
9.1.4 Hold Function .................................................................................................................10
9.2 WRITE PROTECTION.................................................................................................. 11
9.2.1 Write Protect Features....................................................................................................11
10. CONTROL AND STATUS REGISTERS................................................................................... 12
10.1 STATUS REGISTER .................................................................................................... 12
10.1.1 BUSY............................................................................................................................12
10.1.2 Write Enable Latch (WEL) ............................................................................................12
10.1.3 Block Protect Bits (BP2, BP1, BP0)..............................................................................12
10.1.4 Top/Bottom Block Protect (TB).....................................................................................12
10.1.5 Sector/Block Protect (SEC) ..........................................................................................12
10.1.6 Status Register Protect (SRP1, SRP0).........................................................................13
10.1.7 Quad Enable (QE) ........................................................................................................13
10.1.8 Status Register Memory Protection..............................................................................15
10.2 INSTRUCTIONS........................................................................................................... 18
10.2.1 Manufacturer and Device Identification ........................................................................18
10.2.2 Instruction Set Table 1..................................................................................................19
10.2.3 Instruction Set Table 2 (Read Instructions) ..................................................................20
W25Q80, W25Q16, W25Q32
Publication Release Date: September 26, 2007
- 3 - Preliminary - Revision B
10.2.4 Write Enable (06h)........................................................................................................21
10.2.5 Write Disable (04h).......................................................................................................21
10.2.6 Read Status Register-1 (05h) and Read Status Register-2 (35h).................................22
10.2.7 Write Status Register (01h) ..........................................................................................23
10.2.8 Read Data (03h) ...........................................................................................................24
10.2.9 Fast Read (0Bh) ...........................................................................................................25
10.2.10 Fast Read Dual Output (3Bh) .....................................................................................26
10.2.11 Fast Read Quad Output (6Bh)....................................................................................27
10.2.12 Fast Read Dual I/O (BBh)...........................................................................................28
10.2.13 Fast Read Quad I/O (EBh) .........................................................................................30
10.2.14 Page Program (02h) ...................................................................................................32
10.2.15 Quad Input Page Program (32h) ................................................................................33
10.2.16 Sector Erase (20h) .....................................................................................................34
10.2.17 32KB Block Erase (52h) .............................................................................................35
10.2.18 64KB Block Erase (D8h).............................................................................................36
10.2.19 Chip Erase (C7h / 60h)...............................................................................................37
10.2.20 Erase Suspend (75h)..................................................................................................38
10.2.21 Erase Resume (7Ah) ..................................................................................................38
10.2.22 Power-down (B9h)......................................................................................................39
10.2.23 High Performance Mode (A3h) ...................................................................................40
10.2.24 Release Power-down or High Performance Mode / Device ID (ABh) .........................40
10.2.25 Read Manufacturer / Device ID (90h) .........................................................................42
10.2.26 Read Unique ID Number ............................................................................................43
10.2.27 JEDEC ID (9Fh) .........................................................................................................44
10.2.28 Mode Bit Reset (FFh or FFFFh) .................................................................................45
11. ELECTRICAL CHARACTERISTICS (PRELIMINARY)............................................................. 46
11.1 Absolute Maximum Ratings .......................................................................................... 46
11.2 Operating Ranges......................................................................................................... 46
11.3 Endurance and Data Retention .................................................................................... 47
11.4 Power-up Timing and Write Inhibit Threshold .............................................................. 47
11.5 DC Electrical Characteristics ........................................................................................ 48
11.6 AC Measurement Conditions........................................................................................ 49
11.7 AC Electrical Characteristics ........................................................................................ 50
11.8 AC Electrical Characteristics (cont’d) ........................................................................... 51
11.9 Serial Output Timing ..................................................................................................... 52
11.10 Input Timing................................................................................................................. 52
11.11 Hold Timing ................................................................................................................. 52
12. PACKAGE SPECIFICATION .................................................................................................... 53
W25Q80, W25Q16, W25Q32
- 4 -
12.1 8-Pin SOIC 208-mil (Package Code SS)...................................................................... 53
12.2 8-Pin PDIP 300-mil (Package Code DA) ...................................................................... 54
12.3 8-contact 6x5 WSON (Package Code ZP) ................................................................... 55
12.4 8-contact 6x5 WSON Cont’d. ....................................................................................... 56
12.5 16-Pin SOIC 300-mil (Package Code SF).................................................................... 57
13. ORDERING INFORMATION .................................................................................................... 58
13.1 Valid Part Numbers and Top Side Marking .................................................................. 59
14. REVISION HISTORY ................................................................................................................ 60
W25Q80, W25Q16, W25Q32
Publication Release Date: September 26, 2007
- 5 - Preliminary - Revision B
1. GENERAL DESCRIPTION
The W25Q80 (8M-bit), W25Q16 (16M-bit), and W25Q32 (32M-bit) Serial Flash memories provide a
storage solution for systems with limited space, pins and power. The 25Q series offers flexibility and
performance well beyond ordinary Serial Flash devices. They are ideal for code shadowing to RAM,
executing code directly from Dual/Quad SPI (XIP) and storing voice, text and data. The devices
operate on a single 2.7V to 3.6V power supply with current consumption as low as 5mA active and
1µA for power-down. All devices are offered in space-saving packages.
The W25Q80/16/32 array is organized into 4,096/8,192/16,384 programmable pages of 256-bytes
each. Up to 256 bytes can be programmed at a time using the Page Program instructions. Pages can
be erased in groups of 16 (sector erase), groups of 128 (32KB block erase), groups of 256 (64KB
block erase) or the entire chip (chip erase). The W25Q80/16/32 has 256/512/1024 erasable sectors
and 16/32/64 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in
applications that require data and parameter storage. (See figure 2.)
The W25Q80/16/32 supports the standard Serial Peripheral Interface (SPI), and a high performance
Dual/Quad output as well as Dual/Quad I/O SPI using SPI pins: Serial Clock, Chip Select, Serial Data
I/O0 (DI), I/O1 (DO), I/O2 (/WP), and I/O3 (/HOLD). SPI clock frequencies of up to 80MHz are
supported allowing equivalent clock rates of 160MHz for Dual Output and 320MHz for Quad Output
when using the Fast Read Dual/Quad Output instructions. These transfer rates are comparable to
those of 8 and 16-bit Parallel Flash memories.
A Hold pin, Write Protect pin and programmable write protection, with top or bottom array control,
provide further control flexibility. Additionally, the device supports JEDEC standard manufacturer and
device identification with a 64-bit Unique Serial Number.
2. FEATURES
• Family of SpiFlash Memories
– W25Q80: 8M-bit / 1M -byte (1,048,576)
– W25Q16: 16M-bit / 2M-byte (2,097,152)
– W25Q32: 32M-bit / 4M-byte (4,194,304)
– 256-bytes per programmable page
• Standard, Dual or Quad SPI
– Standard SPI: CLK, /CS, DI, DO, /WP, /Hold
– Dual SPI: CLK, /CS, IO
0
, IO
1
, /WP, /Hold
– Quad SPI: CLK, /CS, IO
0
, IO
1
, IO
2
, IO
3
• Highest Performance Serial Flash
– Up to 6X that of ordinary Serial Flash
– 80MHz clock operation
– 160MHz equivalent Dual SPI
– 320MHz equivalent Quad SPI
– 40MB/S continuous data transfer rate
– 30MB/S random access (32-byte fetch)
– Comparable to X16 Parallel Flash
• Low Power, Wide Temperature Range
– Single 2.7 to 3.6V supply
– 4mA active current, <1µA Power-down (typ.)
– -40°C to +85°C operating range
• Flexible Architecture with 4KB sectors
– Uniform Sector Erase (4K-bytes)
– Block Erase (32K and 64K-bytes)
– Program one to 256 bytes
– Up to 100,000 erase/write cycles
– 20-year data retention
• Advanced Security Features
– Software and Hardware Write-Protect
– Top or Bottom, Sector or Block selection
– Lock-Down and OTP protection
(1)
– 64-Bit Unique ID for each device
(1)
Note 1:
These features are on special order.
Please contact Winbond for details.
• Space Efficient Packaging
– 8-pin SOIC 208-mil
– 8-pad WSON 6x5-mm (W25Q80 & W25Q16)
–16-pin SOIC 300-mil (W25Q16 & W25Q32)
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