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### 高通MSM6280移动站调制解调器知识点详解 #### 概述高通MSM6280是一款先进的移动站调制解调器(Mobile Station Modem, MSM)，专为满足现代移动通信需求而设计。该文档提供了关于MSM6280的关键信息和技术细节，包括其特性、接口和支持的技术标准等。 #### 范围与目标受众本文档旨在为硬件工程师、软件开发者以及其他与MSM6280相关的技术专业人员提供必要的信息。通过这些信息，他们可以更好地理解和利用MSM6280的各项功能来开发高质量的移动设备。 #### 应用描述 MSM6280是一款高度集成的移动通信解决方案，支持多种无线通信技术，包括但不限于HSDPA（高速下行链路分组接入）、WCDMA R99（宽带码分多址）、GSM（全球移动通信系统）、GPRS（通用分组无线服务）以及EDGE（增强型数据速率GSM演进）。此外，它还支持先进的音频处理技术和多媒体功能，能够为用户提供优质的通信体验。 #### MSM6280设备特性 - **MSM6280设备一般特性**：MSM6280采用高度集成的设计，内置了强大的微处理器子系统，能够高效地处理各种复杂的计算任务。 - **HSDPA特性**：支持HSDPA技术，能够实现高达7.2 Mbps的下行链路传输速率，为用户提供更快的数据传输速度。 - **WCDMA R99特性**：兼容WCDMA R99标准，确保在不同网络环境下都能提供稳定的连接。 - **GSM特性**：支持GSM标准，能够在全球范围内提供基本的语音和数据服务。 - **GPRS特性**：支持GPRS，可实现比传统GSM网络更高的数据传输速率。 - **EDGE特性**：兼容EDGE技术，进一步提高了数据传输速率，增强了用户体验。 - **音频处理特性**：配备了先进的音频处理功能，如噪声抑制和回声消除，以提高通话质量。 - **微处理器子系统**：内置高性能微处理器，能够支持复杂的计算任务和多媒体应用。 #### 支持的接口特性 MSM6280支持多种接口特性，包括但不限于USB、SPI、I2C等，这使得它可以轻松与其他组件进行交互，提高整体系统的灵活性和扩展性。 #### 支持的多媒体特性 - **图像处理**：支持高清图像处理，能够处理高质量的照片和视频。 - **视频编解码**：支持多种视频编解码格式，如MPEG-4、H.264等，提供流畅的视频播放体验。 - **音频编解码**：支持多种音频编解码格式，如MP3、AAC等，确保高质量的音频输出。 #### 引脚描述 - **I/O参数描述**：文档中提供了详细的输入/输出引脚参数，包括电压范围、电流消耗等信息，帮助工程师更好地了解每个引脚的功能和限制条件。 - **MSM6280引脚矩阵**：提供了MSM6280所有引脚的功能说明，便于硬件设计时正确连接外部设备。 #### 电气规格文档还详细介绍了MSM6280的电气规格，包括工作电压、最大功耗、信号电平等关键参数，这对于确保设备正常运行至关重要。 MSM6280是一款功能强大且高度集成的移动通信解决方案，支持多种无线通信技术，并具备先进的音频处理能力和多媒体功能。通过充分利用这些特性，MSM6280能够为用户提供卓越的通信体验和丰富的多媒体服务。

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QUALCOMM Proprietary

Restricted Distribution. This document contains critical information about QUALCOMM products and may not be

distributed to anyone that is not an employee of QUALCOMM, its affiliates or subsidiaries without the approval of

Configuration Management.

All data and information contained in or disclosed by this document is confidential and proprietary information of

QUALCOMM Incorporated and all rights therein are expressly reserved. By accepting this material the recipient

agrees that this material and the information contained therein is to be held in confidence and in trust and will not be

used, copied, reproduced in whole or in part, nor its contents revealed in any manner to others without the express

written permission of QUALCOMM Incorporated.

QUALCOMM is a registered trademark and registered service mark of QUALCOMM Incorporated. Other product

and brand names may be trademarks or registered trademarks of their respective owners. CDMA2000 is a registered

certification mark of the Telecommunications Industry Association, used under license. ARM is a registered

trademark of ARM Limited. QDSP is a registered trademark of QUALCOMM Incorporated in the United States and

other countries.

Export of this technology may be controlled by the United States Government. Diversion contrary to U.S. law

prohibited.

QUALCOMM Incorporated

5775 Morehouse Drive

San Diego, CA 92121-1714

U.S.A.

MSM6280™ Mobile Station Modem™

Device Specification (Advance Information)

80-V6968-1 Rev. C

December 31, 2005

Submit technical questions at:

https://support.cdmatech.com/

80-V6968-1 Rev. C 2 QUALCOMM Proprietary

Contents

1 Overview ........................................................................................................ 12

1.1 Scope and intended audience ...................................................................................... 12

1.2 Application description............................................................................................... 12

1.3 MSM6280 device features .......................................................................................... 16

1.3.1 MSM6280 device general features.................................................................... 18

1.3.2 HSDPA features ................................................................................................ 18

1.3.3 WCDMA R99 features...................................................................................... 19

1.3.4 GSM features..................................................................................................... 20

1.3.5 GPRS features ................................................................................................... 20

1.3.6 EDGE features................................................................................................... 20

1.3.7 MSM6280 device audio processing features..................................................... 21

1.3.8 MSM6280 microprocessor subsystem .............................................................. 21

1.3.9 Supported interface features .............................................................................. 22

1.3.10 Supported multimedia features........................................................................ 22

2 Pin Descriptions ............................................................................................ 25

2.1 I/O description parameters.......................................................................................... 25

2.2 MSM6280 pin mode matrix........................................................................................ 27

3 Electrical Specifications ............................................................................... 69

3.1 DC electrical specifications ........................................................................................ 69

3.1.1 Absolute maximum ratings ............................................................................... 69

3.1.2 Recommended operating conditions ................................................................. 70

3.1.3 Thermal characteristics...................................................................................... 70

3.1.4 DC characteristics.............................................................................................. 71

3.1.5 Power consumption characteristics ................................................................... 73

3.1.5.1 Average current consumption.................................................................. 73

3.1.6 Power sequencing.............................................................................................. 74

3.1.6.1 Power-up recommendations..................................................................... 74

3.1.6.2 Justification.............................................................................................. 74

3.2 Timing characteristics................................................................................................. 74

3.2.1 Timing diagrams................................................................................................ 74

3.2.2 Rise and fall time............................................................................................... 75

3.2.3 Top-level description of pad design methodology ............................................ 76

3.2.4 Clocks................................................................................................................ 78

MSM6280™ Mobile Station Modem™ Device Specification (Advance Information) Contents

80-V6968-1 Rev. C 3 QUALCOMM Proprietary

3.2.4.1 TCXO timing ........................................................................................... 78

3.2.4.2 HCLK and MCLK timing and jitter......................................................... 78

3.2.5 EBI1 timing requirements ................................................................................. 79

3.2.5.1 SDRAM timing........................................................................................ 79

3.2.6 EBI2 .................................................................................................................. 83

3.2.6.1 EBI2 asynchronous 16-bit memory read and write ................................. 83

3.2.6.2 EBI2 asynchronous bus-sized read-write access to 16-bit memory......... 85

3.2.6.3 EBI2 NAND interface ............................................................................. 86

3.2.6.4 EBI2 LCD interface ................................................................................. 91

3.2.7 Auxiliary interface............................................................................................. 95

3.2.7.1 CAMIF..................................................................................................... 95

3.2.7.2 JTAG........................................................................................................ 96

3.3 Mixed signal characteristics........................................................................................ 97

3.3.1 HKADC specifications...................................................................................... 97

3.3.2 PCM interface ................................................................................................... 98

3.3.3 Auxiliary PCM interface ................................................................................... 99

3.3.4 CODEC specifications .................................................................................... 101

3.3.5 Sleep clock ...................................................................................................... 119

3.3.6 USB clock ....................................................................................................... 120

4 Package Specifications............................................................................... 121

4.1 409 CSP .................................................................................................................... 121

4.2 MSM6280 device part marking ................................................................................ 123

5 Package/Tape and Reel............................................................................... 124

5.1 Packing of shipments ................................................................................................ 124

5.2 Packing materials...................................................................................................... 126

5.3 Moisture sensitivity level.......................................................................................... 128

6 Part Mounting Specifications ..................................................................... 129

6.1 Characterization ........................................................................................................ 129

6.2 Conditions for storage after unpacking..................................................................... 130

6.2.1 Storage conditions ........................................................................................... 130

6.2.2 Out-of-bag time duration................................................................................. 130

6.2.3 Baking ............................................................................................................. 130

7 Part Reliability Test Specification .............................................................. 131

7.1 Reliability qualifications summary ........................................................................... 131

7.2 Qualification sample description .............................................................................. 132

MSM6280™ Mobile Station Modem™ Device Specification (Advance Information) Contents

80-V6968-1 Rev. C 4 QUALCOMM Proprietary

Figures

Figure 1-1 MSM6280 system functional diagram (Platform 3U)................................................. 17

Figure 2-1 409-ball CSP pinout for the MSM6280 device........................................................... 68

Figure 3-1 IV curve for V

and V

for V

DD_PX

= 1.8 V or 2.6 V .............................................. 73

Figure 3-2 Timing diagram waveforms ........................................................................................ 75

Figure 3-3 Rise and fall time in different load conditions ............................................................ 75

Figure 3-4 MSM6280 input signals DC characteristics................................................................ 76

Figure 3-5 MSM6280 output PAD equivalent circuit .................................................................. 77

Figure 3-6 TCXO timing parameters............................................................................................ 78

Figure 3-7 SDRAM clock for T = 13.63 ns .................................................................................. 79

Figure 3-8 SDRAM RAS timing .................................................................................................. 80

Figure 3-9 SDRAM read timing ................................................................................................... 80

Figure 3-10 SDRAM write timing................................................................................................ 81

Figure 3-11 SDRAM clock gating: (MPMCDynamicReadConfig[1:0] = “01”).......................... 81

Figure 3-12 Asynchronous 16-bit read-write accesses ................................................................. 83

Figure 3-13 EBI2 asynchronous bus-sized access to 16-bit memory ........................................... 85

Figure 3-14 Write timing [command/address/data cycles] ........................................................... 87

Figure 3-15 Consecutive write access timing sequence................................................................ 87

Figure 3-16 NAND read cycles (ID, status, data)......................................................................... 89

Figure 3-17 Consecutive data read access timing sequence ......................................................... 89

Figure 3-18 Motorola-style LCD interface write timing............................................................... 91

Figure 3-19 Motorola-style LCD interface read timing................................................................ 92

Figure 3-20 Intel-style LCD interface write timing ...................................................................... 93

Figure 3-21 Intel-style LCD interface read timing ....................................................................... 94

Figure 3-22 CAMIF CLK timing.................................................................................................. 95

Figure 3-23 CAMIF signals .......................................................................................................... 95

Figure 3-24 JTAG interface timing............................................................................................... 96

Figure 3-25 PCM_SYNC timing .................................................................................................. 98

Figure 3-26 PCM_CODEC to MSM6280 timing......................................................................... 98

Figure 3-27 MSM6280 to PCM_CODEC timing......................................................................... 98

Figure 3-28 AUX_PCM_SYNC timing........................................................................................ 99

Figure 3-29 AUX_PCM_CODEC to MSM6280 timing ............................................................ 100

Figure 3-30 MSM6280 to AUX_PCM_CODEC timing ............................................................ 100

Figure 3-31 Sleep clock timing parameters ................................................................................ 119

Figure 3-32 USB clock timing parameters ................................................................................. 120

Figure 4-1 409 CSP land pattern drawing................................................................................... 121

Figure 4-2 409 CSP solder stencil design – square aperture....................................................... 122

Figure 4-3 409 CSP solder stencil design – circular aperture..................................................... 122

Figure 4-4 MSM6280 device part marking................................................................................. 123

Figure 5-1 Bag packing for tape and reel.................................................................................... 124

Figure 5-2 Box packing for tape and reel ................................................................................... 125

Figure 5-3 Tape and reel box...................................................................................................... 125

Figure 5-4 Tape handling............................................................................................................ 126

Figure 5-5 Tape dimensions for the 409-ball CSP...................................................................... 126

Figure 5-6 Example barcode label .............................................................................................. 127

Figure 5-7 Six-dot and three-dot example HICs......................................................................... 127

Figure 5-8 Caution label ............................................................................................................. 128

MSM6280™ Mobile Station Modem™ Device Specification (Advance Information) Contents

80-V6968-1 Rev. C 5 QUALCOMM Proprietary

Tables

Table 1-1 Summary of MSM6280 device features....................................................................... 24

Table 2-1 I/O description (pad type) parameters .......................................................................... 25

Table 2-2 Pin descriptions for the MSM6280 device ................................................................... 27

Table 2-3 Input pins routed to MPM ............................................................................................ 66

Table 3-1 Absolute maximum ratings........................................................................................... 69

Table 3-2 Recommended operating conditions ............................................................................ 70

Table 3-3 Thermal resistance........................................................................................................ 70

Table 3-4 DC characteristics [for V

DD_PX

= 1.8 V] ....................................................................... 71

Table 3-5 DC characteristics [for V

DD_PX

= 2.5 – 2.7 V] .............................................................. 72

Table 3-6 Capacitive load de-rating factor ................................................................................... 76

Table 3-7 TCXO timing parameters ............................................................................................. 78

Table 3-8 HCLK and MCLK timing parameters.......................................................................... 78

Table 3-9 HCLK clock period ...................................................................................................... 79

Table 3-10 SDRAM controller timing.......................................................................................... 82

Table 3-11 EBI2 asynchronous 16-bit access timing.................................................................... 84

Table 3-12 EBI2 asynchronous bus-sized access timing .............................................................. 85

Table 3-13 NAND write timing – AC characteristics................................................................... 88

Table 3-14 NAND read timing – AC characteristics.................................................................... 90

Table 3-15 Motorola-style LCD write .......................................................................................... 91

Table 3-16 Motorola-style LCD read............................................................................................ 92

Table 3-17 Intel-style LCD write.................................................................................................. 93

Table 3-18 Intel-style LCD read ................................................................................................... 94

Table 3-19 CAMIF CLK timing ................................................................................................... 95

Table 3-20 CAMIF signals ........................................................................................................... 95

Table 3-21 JTAG interface timing................................................................................................ 96

Table 3-22 HKADC performance specification ........................................................................... 97

Table 3-23 PCM_CODEC timing parameters .............................................................................. 99

Table 3-24 AUX_CODEC timing parameters............................................................................ 100

Table 3-25 Microphone interface requirements.......................................................................... 101

Table 3-26 Speaker interface requirements ................................................................................ 101

Table 3-27 Transmit voice path level translation and linearity, mic amp2 enabled ................... 102

Table 3-28 Transmit voice path level translation and linearity, mic amp2 bypassed ................. 103

Table 3-29 Transmit voice path frequency response and image rejection, digital transmit

slope filter disabled, mic amp2 bypassed.....................................................................................

103

Table 3-30 Transmit voice path frequency response and image rejection, digital transmit

slope filter enabled, mic amp2 bypassed .....................................................................................

104

Table 3-31 Transmit voice path idle channel noise and distortion (8K)..................................... 105

Table 3-32 Transmit voice path idle channel noise and distortion (16K)................................... 105

Table 3-33 Receive voice path level translation and linearity, EAR_AMP1 selected................ 106

Table 3-34 Receive voice path level translation and linearity, EAR_AMP2 selected................ 106

Table 3-35 Receive voice path level translation and linearity, EAR_AMP3 selected................ 107

Table 3-36 Receive voice path level translation and linearity, AUX_AMP selected ................. 107

Table 3-37 Receive voice path frequency response and image rejection ................................... 108

Table 3-38 Receive voice path idle channel noise and distortion, EAR_AMP1 selected .......... 108

Table 3-39 Receive voice path idle channel noise and distortion, EAR_AMP2 selected .......... 109

Table 3-40 Receive voice path idle channel noise and distortion, EAR_AMP3 selected .......... 109

Table 3-41 Receive voice path idle channel noise and distortion, AUX_AMP selected............ 110

Table 3-42 Receive audio path level translation and linearity, EAR_AMP2 selected ............... 111

剩余131页未读，继续阅读

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yewing_li

2012-03-01

只是一份规格书，不过参考还行！！
hoff_wu

2017-01-11

规格书还可以

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