【免费】【1_en_cn】NXP-MPL3115A2_1_52_中文英文数据手册

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《NXP MPL3115A2：I2C精密压力传感器与高度测量》 NXP公司的MPL3115A2是一款专为压力和高度测量设计的高性能传感器，其核心特性在于其I2C数字接口，这使得它能够轻松地与各种微控制器(MCU)集成。该传感器的工作范围广泛，涵盖了从20kPa到110kPa的绝对压力值，这相当于地球上所有可能的表面海拔高度。 MPL3115A2内含一个片上温度传感器，用于进行温度补偿，确保在不同环境温度下的测量精度。压力和温度数据通过高分辨率模拟数字转换器(ADC)转换为20位的压力读数（以帕斯卡计）和12位的温度读数（以摄氏度计）。这些数据可以直接读取，无需额外的计算或补偿步骤。该传感器的突出优点之一是其内部处理能力，它可以自动进行补偿和单位转换，减轻了系统MCU的负担，简化了系统设计流程。MPL3115A2还提供了多种用户可编程模式，包括节能模式、中断模式和自主数据采集模式。其中，自主数据采集模式允许用户设置可编程的采集周期定时，而仅轮询模式则适用于特定应用需求。在功耗方面，MPL3115A2表现优异，当需要稳定在10cm的输出分辨率时，典型有源电源电流仅为每测量秒40μA。这意味着在保持高精度的同时，也能实现低功耗操作。传感器的电源电压范围为1.95V至3.6V，数字接口电源电压则为1.6V至3.6V，适应性强。工作温度范围为-40°C至+85°C，确保了在各种环境条件下都能稳定工作。 MPL3115A2内部还包括一个32样本的先进先出(FIFO)缓冲区，可以存储多达12天的数据，这对于需要连续记录和分析数据的应用来说非常实用。此外，数据采集速率可以从1秒到9小时不等，可以根据具体应用场景灵活调整。 NXP MPL3115A2是一款集精确度、灵活性和低功耗于一体的I2C压力传感器，特别适合于需要进行大气压力和海拔高度测量的物联网设备、气象站、无人机、户外运动装备等应用。它的强大功能和易用性使其成为开发者在设计相关系统时的理想选择。

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– Pressure: 20-bit measurement (Pascals)

–

– Altitude: 20-bit measurement (meters)

–

– Temperature: 12-bit measurement (°C)

–

MPL3115A2具有高度测量功能的I2C

精密压力传感器Rev.7—2018年2月15

日

数据表：技术数据

一般说明

MPL3115A2是一款具有I2C数字接口的紧凑型压阻式绝对压力传感器。MPL3115A2具有2

0kPa至110kPa的宽工作范围，该范围涵盖地球上的所有表面高度。MEMS是利用片上温

度传感器进行温度补偿的。压力和温度数据被送入高分辨率ADC，以提供完全补偿和数

字化的输出压力（帕斯卡）和温度（°C）。然后可以使用第9.1.3节“压力/高度”中以

米为单位提供的公式将补偿后的压力输出转换为高度。MPL3115A2中的内部处理消除了

系统MCU的补偿和单位转换负载，简化了系统设计。

MPL3115A2的高级ASIC具有多种用户可编程模式，例如省电、中断和自主数据采集模式

，包括可编程采集周期时序和仅轮询模式。对于稳定的10cm输出分辨率，典型的有源电

源电流为40μApermeasurement-second。

特点和优势

工作范围：20kPa至110kPa绝对压力校准范围：50kPa至110

绝对压力校准温度输出：-40°C至85°CI2C数字输出接口

部完全补偿精密ADC导致0.1有效分辨率仪表直读

20至110kPa

698至11,775m

40°C至85°C

可编程中断自主数据采集

嵌入式32样本FIFO使用FIFO最多可记录12天的

数据1秒到9小时的数据采集速率

1.95V至3.6V电源电压，内部调节1.6V至3.6V数字接口

电源电压工作温度为40°C至+85°C

MPL3115A2

C precision pressure sensor with altimetry

Rev. 7 — 15 February 2018 Data sheet: technical data

1 General description

The MPL3115A2 is a compact, piezoresistive, absolute pressure sensor with an I

digital interface. MPL3115A2 has a wide operating range of 20 kPa to 110 kPa, a range

that covers all surface elevations on earth. The MEMS is temperature compensated

utilizing an on-chip temperature sensor. The pressure and temperature data is fed into

a high resolution ADC to provide fully compensated and digitized outputs for pressure

in Pascals and temperature in °C. The compensated pressure output can then be

converted to altitude, utilizing the formula stated in Section 9.1.3 "Pressure/altitude"

provided in meters.The internal processing in MPL3115A2 removes compensation and

unit conversion load from the system MCU, simplifying system design.

MPL3115A2's advanced ASIC has multiple user programmable modes such as power

saving, interrupt and autonomous data acquisition modes, including programmed

acquisition cycle timing, and poll-only modes. Typical active supply current is 40 μA per

measurement-second for a stable 10 cm output resolution.

2 Features and benefits

• Operating range: 20 kPa to 110 kPa absolute pressure

• Calibrated range: 50 kPa to 110 kPa absolute pressure

• Calibrated temperature output: −40 °C to 85 °C

• I

C digital output interface

• Fully compensated internally

• Precision ADC resulting in 0.1 meter of effective resolution

• Direct reading

– Pressure: 20-bit measurement (Pascals)

– 20 to 110 kPa

– Altitude: 20-bit measurement (meters)

– –698 to 11,775 m

– Temperature: 12-bit measurement (°C)

– –40 °C to 85 °C

• Programmable interrupts

• Autonomous data acquisition

– Embedded 32-sample FIFO

– Data logging up to 12 days using the FIFO

– One-second to nine-hour data acquisition rate

• 1.95 V to 3.6 V supply voltage, internally regulated

• 1.6 V to 3.6 V digital interface supply voltage

• Operating temperature from −40 °C to +85 °C

NXP Semiconductors

MPL3115A2

4 / 52

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带高度计的I2C精密压力传感器

本文档中提供的所有信息均受法律免责声明的约束。

数据表：技术数据修订版7—2018年2月15日

器件电源通过VDD线提供。电源去耦电容器（100nF陶瓷加10μF大容量电容器或10μF陶

瓷电容器）应尽可能靠近器件的引脚1。第二个100nF电容器用于绕过内部稳压器。中断引

脚（INT1和INT2）的功能、阈值和时序可由用户通过I2C接口编程。

处理和板安装建议

传感器芯片对曝光敏感。通过端口孔直接曝光会导致压力测量的准确性不同。避免在正

常操作期间暴露于端口。

处理方法

可以使用真空辅助或机械式拾取头从载带中拾取元件。真空辅助喷嘴类型最常见，因为它

的维护成本较低且易于操作。推荐的真空喷嘴配置应设计为直接与金属盖上的设备接触，

并避免真空端口直接位于设备金属盖上的通风孔上方。可能需要喷嘴内的多个真空端口来

有效地处理设备并防止在移动到放置位置期间移动。

充分支撑组件所需的真空压力应约为25inHg(85kPa)。这个级别是内部真空供应的典型水

平。吸嘴有各种尺寸和配置，以适应各种组件的几何形状。要选择最适合特定应用的吸

嘴，建议客户咨询其贴装设备供应商以确定正确的吸嘴。在某些情况下，可能需要根据

设备和操作速度制造特殊喷嘴。

不建议使用带有尖头的镊子或其他机械形式的处理方式，因为它们可能会无意中插入设

备的通风孔中。这会导致MEMS元件被刺穿，从而导致设备无法运行。

板安装建议

在放置元件之前，可以使用焊膏模板、丝网印刷或点胶将元件安装到PCB焊盘上。施加到

PCB上的焊膏量通常足以在运输到随后的回流焊接过程中固定元件。不建议使用粘合剂来

固定组件，但可以在必要时将其应用于设备的底部。

焊膏有多种金属成分、颗粒大小和助焊剂类型可供选择。焊膏由金属和助焊剂组成，用

于元件引线和PCB焊盘之间的可靠连接。助焊剂有助于去除PCB焊盘上可能存在的氧化

物，并防止在焊接过程中发生进一步氧化。

建议对裸露的腔体组件使用免清洗(NC)助焊剂。不建议使用压力喷涂、钢丝刷或其他

清洁方法，因为它会刺穿MEMS设备并使其无法使用。如果清洗pcbis，可以使用水溶

性(WS)助焊剂。但是，建议在清洁过程之前用粘性Kapton胶带、乙烯基帽或其他方式

保护元件腔。这种覆盖物将防止损坏MEMS设备，

趣卡社区（www.qukaa.com）

NXP Semiconductors

MPL3115A2

C precision pressure sensor with altimetry

Data sheet: technical data Rev. 7 — 15 February 2018

4 / 52

The device power is supplied through the V

line. Power supply decoupling capacitors

(100 nF ceramic plus 10 μF bulk or 10 μF ceramic) should be placed as near as possible

to pin 1 of the device. A second 100 nF capacitor is used to bypass the internal regulator.

The functions, threshold and the timing of the interrupt pins (INT1 and INT2) are user

programmable through the I

C interface.

8 Handling and board mount recommendations

The sensor die is sensitive to light exposure. Direct light exposure through the port hole

can lead to varied accuracy of pressure measurement. Avoid such exposure to the port

during normal operation.

8.1 Methods of handling

Components can be picked from the carrier tape using either the vacuum assist or the

mechanical type pickup heads. A vacuum assist nozzle type is most common due to its

lower cost of maintenance and ease of operation. The recommended vacuum nozzle

configuration should be designed to make contact with the device directly on the metal

cover and avoid vacuum port location directly over the vent hole in the metal cover of the

device. Multiple vacuum ports within the nozzle may be required to effectively handle the

device and prevent shifting during movement to placement position.

Vacuum pressure required to adequately support the component should be

approximately 25 in Hg (85kPa). This level is typical of in-house vacuum supply.

Pickup nozzles are available in various sizes and configurations to suit a variety of

component geometries. To select the nozzle best suited for the specific application, it

is recommended that the customer consult their pick and place equipment supplier to

determine the correct nozzle. In some cases it may be necessary to fabricate a special

nozzle depending on the equipment and speed of operation.

Tweezers or other mechanical forms of handling that have a sharp point are not

recommended since they can inadvertently be inserted into the vent hole of the device.

This can lead to a puncture of the MEMS element that will render the device inoperable.

8.2 Board mount recommendations

Components can be mounted using solder paste stencil, screen printed or dispensed

onto the PCB pads prior to placement of the component. The volume of solder paste

applied to the PCB is normally sufficient to secure the component during transport to the

subsequent reflow soldering process. Use of adhesives to secure the component is not

recommended, but where necessary can be applied to the underside of the device.

Solder pastes are available in variety of metal compositions, particle size and flux types.

The solder paste consists of metals and flux required for a reliable connection between

the component lead and the PCB pad. Flux aids the removal of oxides that may be

present on PCB pads and prevents further oxidation from occurring during the solder

process.

The use of a No-Clean (NC) flux is recommended for exposed cavity components.

Using pressure spray, wire brush, or other methods of cleaning is not recommended

since it can puncture the MEMS device and render it unusable. If cleaning of the pcb

is performed Water Soluble (WS) flux can be used. However, it is recommended the

component cavity is protected by adhesive Kapton tape, vinyl cap or other means

prior to the cleaning process. This covering will prevent damage to the MEMS device,

NXP Semiconductors

MPL3115A2

5 / 52

9.1 Terminology

9.1.1 Resolution

9.1.2 Accuracy

9.1.2.1 Offset

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带高度计的I2C精密压力传感器

本文档中提供的所有信息均受法律免责声明的约束。

数据表：技术数据修订版7—2018年2月15日

由于清洁过程，污染和异物被引入设备腔体。

不建议使用超声波清洗，因为该频率会损坏引线键合互连和MEMS设备。

机械和电气规格

压力传感器的分辨率是可以可靠测量的最小压力变化。设备的可用分辨率是可编程的，

使用户能够在采集速度、功耗和分辨率之间选择最适合应用的折衷方案。为了简化编程

，数据总是以相同的格式报告，但可用位数不同。

偏移量定义为参考压力（绝对压力传感器的真空）施加到传感器时获得的输出信号。偏移

误差影响绝对压力测量但不影响相对压力测量。海拔测量值是相对于海平面的压力值，气

压测量值是传感器读取的压力值。即，所见总压力（例如70kPa）或海平面以上总高度（例

如3000m）的测量值。偏移量的变化将影响海平面上方的压力值或高度，因为它会移动海

平面基准参考。绝对压力测量与相对压力测量不同，相对压力测量是在较短的间隔内升高

或降低压力时比较压力。这将是一次步行上山，测量从开始到结束的压力和高度差。在相

对情况下，偏移偏移在两个绝对测量中共享，并在压力计算期间相互抵消。

对于MPL3115A2，可以通过调整压力或高度偏移校正来消除长期偏移偏移。请参阅第14.2

3节“偏移校正寄存器”。提供此调整是为了覆盖工厂编程值，以补偿由制造和安装应力

引入的偏移。强烈建议利用它来实现设备的全部精度潜力。

线性将测量数据的斜率与理想传递函数的斜率进行比较。它是指传感器的输出在工作压

力范围内遵循方程POUT=POFF+灵敏度×P直线方程的程度。恩智浦用于给出线性规格

的方法是在中压下测量的端点直线法。

趣卡社区（www.qukaa.com）

NXP Semiconductors

MPL3115A2

C precision pressure sensor with altimetry

Data sheet: technical data Rev. 7 — 15 February 2018

5 / 52

contamination, and foreign materials from being introduced into device cavity as result of

cleaning processes.

Ultrasonic cleaning is not recommended as the frequencies can damage wire bond

interconnections and the MEMS device.

9 Mechanical and electrical specifications

9.1 Terminology

9.1.1 Resolution

The resolution of a pressure sensor is the minimum change of pressure that can be

reliably measured. The usable resolution of the device is programmable, enabling the

user to choose a compromise between acquisition speed, power consumption, and

resolution that best fits the application. To simplify the programming, the data is always

reported in the same format with differing number of usable bits.

9.1.2 Accuracy

9.1.2.1 Offset

The offset is defined as the output signal obtained when the reference pressure

(a vacuum for an absolute pressure sensor) is applied to the sensor. Offset error

affects absolute pressure measurements but not relative pressure measurements. An

altitude measurement is the pressure value in comparison to sea level, a barometric

measurement is the pressure value read by the sensor. That is, a measurement of total

pressure seen (for example 70 kPa), or total height (for example 3000 m) above sea

level. A change in the offset will affect the pressure value or height seen above sea level

as it shifts the sea level base reference. An absolute pressure measurement is not the

same as relative pressure measurement, where the pressure is compared when raising

or lowering pressure in shorter intervals. This would be a walk up a hill, measuring the

pressure and altitude difference from start to finish. In the relative case, the offset shifts

are shared in the two absolute measurements and negate each other during the pressure

calculation.

For the MPL3115A2, the long term offset shift can be removed by adjusting the pressure

or altitude offset correction. See Section 14.23 "Offset correction registers".This

adjustment is provided to override the factory programmed values to compensate for

offsets introduced by manufacturing and mounting stresses. It is highly recommended

that this is utilized to realize the full accuracy potential of the device.

9.1.2.2 Linearity

Linearity compares the slope of the measurement data to that of an ideal

transfer function. It refers to how well a transducer's output follows the equation

OUT

= P

OFF

+ sensitivity × P straight-line equation over the operating pressure range.

The method used by NXP to give the linearity specification is the end-point straight line

method measured at midrange pressure.

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