PCI Express M.2
Specification
Revision 1.1
March 7, 2016
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PCI Express M.2 Specification
PCI Express M.2 Specification | 3
Revision 1.1, March 7, 2016
Revision History
Rev
Version
History
Date
1.0
Initial Release
November 1, 2013
1.1
Incorporated the following ECNs:
Transition of NFC Signals from 3.3V to 1.8V ECN
M.2 COEX Signal Definition – UART ECN
M.2 2242 WWAN Module ECN
M.2 Signal Definition – Audio & ANTCTL Functions ECN
Tx Blanking and SYSCLK on Socket 1 Related Pinouts ECN
Power-up Requirements for PCIe Side Bands (PERST#, etc.) ECN
Power-up Requirements for PCIe Side Bands in a VBAT Powered System
ECN
MiniEx_M2_ECN_SMBus_for_SSD_Socket2_Socket3 - 1112_14
WWAN_Key_C_Definition_ECN_WW12.3
SMBus ECN, Clarification
BGA-SSD ECN
M.2 SSIC Eye Limits Definitions
Other changes:
Incorporated all changes from M2_10 Errata Table and Backup of
M 2 Rev1 0 Errata Table 04292015-6.8Added section 6.8, High Speed
Differential Pair AC Coupling Cap Values and Cap Location Examples
Changed all Mid-Line and Mid-plane to Mid-mount per WG decision
March 7, 2016
PCI Express M.2 Specification
PCI Express M.2 Specification | 4
Revision 1.1, March 7, 2016
Table of Contents
1. Introduction to M.2 Specification .................................................................... 19
1.1. Terms and Definitions ...........................................................................................20
1.2. Targeted Application .............................................................................................20
1.3. Specification References ......................................................................................22
2. Mechanical Specification ................................................................................. 23
2.1. Overview ...............................................................................................................23
2.2. Card Type Naming Convention .............................................................................25
2.3. Card Specifications ...............................................................................................28
2.3.1. Card Form Factors Intended for Connectivity Socket 1 ................................28
2.3.2. Card Form Factors Intended for WWAN Socket 2 ........................................33
2.3.3. Card Form Factor for SSD Socket 2 and 3 ...................................................35
2.3.4. Card PCB Details .........................................................................................40
2.3.5. Soldered-down Form Factors .......................................................................46
2.3.6. Soldered-Down Form Factors for BGA SSDs ...............................................54
2.3.7. RF Connectors .............................................................................................63
2.4. System Connector Specifications..........................................................................70
2.4.1. Connector Pin Count ....................................................................................71
2.4.2. Contact Pitch ................................................................................................71
PCI Express M.2 Specification
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Revision 1.1, March 7, 2016
2.4.3. System Connector Parametric Specifications ...............................................71
2.4.4. Additional Environmental Requirements .......................................................73
2.4.5. Card Insertion ..............................................................................................73
2.4.6. Point of Contact Guideline ............................................................................74
2.4.7. Top-side Connection ....................................................................................74
2.4.8. Mid-mount Connection (Using M1.8 Connector) ...........................................82
2.4.9. Connector Key Dimension ............................................................................88
2.5. Module Stand-off ..................................................................................................91
2.5.1. Recommended Main Board Hole .................................................................91
2.5.2. Electrical Ground Path .................................................................................91
2.5.3. Thermal Ground Path ...................................................................................91
2.5.4. Stand-off Guidelines .....................................................................................94
2.5.5. Screw Selection Guideline ...........................................................................96
2.6. Thermal Guidelines for the M.2 .............................................................................98
2.6.1. Objective ......................................................................................................98
2.6.2. Introduction to Thermal Management ...........................................................99
2.6.3. System Skin Temperature—Fanless System ............................................. 100
2.6.4. Examples of Dissipation (TDP) Response of Modules................................ 101