W25Q16BV
目录目录
1.
2.
3.
4.
5.
6.
7.
8.
概述............................................................................................................... 5
FEATURES....................................................................................................................................... 5
引脚配置SOIC二百〇八分之一百五十○-MIL .......................................... ......................................... 6
焊垫配置WSON 6X5-MM ............................................ ............................................ 6
焊垫配置PDIP 300-MIL ............................................ ............................................... 7
引脚说明SOIC 150/208-MIL,PDIP 300-MIL和WSON 6X5-MM ............................... 7
引脚配置SOIC 300-MIL ............................................ ................................................ 8
引脚说明SOIC 300-MIL ............................................ .................................................. 8 ....
8.1
8.2
8.3
8.4
8.5
8.6
9.
10.
包Types..................................................................................................................... 9
片选(/CS).................................................................................................................. 9
串行数据输入,输出和IO（DI,DO和IO0,IO1,IO2,IO3）.............................. 9 ......
写保护(/WP)............................................................................................................... 9
HOLD（/ HOLD） ..................................................................................................................... 9
串行时钟（CLK） ................................................................................................................ 9
BLOCK DIAGRAM.......................................................................................................................... 10
功能描述....................................................................................................... 11
10.1 SPI操作............................................................................................................. 11
10.1.1
10.1.2
10.1.3
10.1.4
标准SPI Instructions...................................................................................................11
双SPI指令..........................................................................................................11
四SPI Instructions.........................................................................................................11
HOLD功能.....................................................................................................................11
写保护Features........................................................................................................12
10.2
11.
写保护....................................................................................................... 12
10.2.1
控制和状态寄存器.............................................. .......................................... 13
11.1 状态寄存器.......................................................................................................... 13
11.1.1
11.1.2
11.1.3
11.1.4
11.1.5
11.1.6
11.1.7
11.1.8
11.1.9
BUSY..................................................................................................................................13
写使能锁存（WEL）............................................ .................................................. .... 13
块保护bits（BP2,BP1,BP0）........................................ ............................................ 13
顶/底块保护（TB）.......................................... .................................................
13
部门/块保护（SEC）........................................... .................................................. 13 ...
状态寄存器保护（SRP,SRP0）.......................................... .....................................
14
擦除挂起状态（SUS）............................................ .................................................
14
四启用（QE） ..............................................................................................................14
状态寄存器内存保护.............................................. ...................................... 16
制造商和设备标识.............................................. ................................ 17
11.2 INSTRUCTIONS................................................................................................................. 17
11.2.1
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