MPU-3000/MPU-3050 Product Specification
Document Number: PS-MPU-3000A-00
Revision: 2.9
Release Date: 11/14/2011
1 of 47
MPU-3000/MPU-3050
Motion Processing Unit
Product Specification
Rev 2.9
MPU-3000/MPU-3050 Product Specification
Document Number: PS-MPU-3000A-00
Revision: 2.9
Release Date: 11/14/2011
2 of 47
CONTENTS
1 DOCUMENT INFORMATION ..................................................................................................................... 4
1.1 REVISION HISTORY ................................................................................................................................. 4
1.2 PURPOSE AND SCOPE ............................................................................................................................ 6
1.3 PRODUCT OVERVIEW.............................................................................................................................. 6
1.4 SOFTWARE SOLUTIONS .......................................................................................................................... 7
1.5 APPLICATIONS ........................................................................................................................................ 9
2 FEATURES ............................................................................................................................................... 10
2.1 SENSORS ............................................................................................................................................. 10
2.2 DIGITAL OUTPUT .................................................................................................................................. 10
2.3 MOTIONPROCESSING ........................................................................................................................... 10
2.4 CLOCKING ............................................................................................................................................ 10
2.5 POWER ................................................................................................................................................ 10
2.6 PACKAGE ............................................................................................................................................. 11
3 ELECTRICAL CHARACTERISTICS ........................................................................................................ 12
3.1 SENSOR SPECIFICATIONS ..................................................................................................................... 12
3.2 ELECTRICAL SPECIFICATIONS................................................................................................................ 13
3.3 ELECTRICAL SPECIFICATIONS, CONTINUED ............................................................................................ 14
3.4 ELECTRICAL SPECIFICATIONS, CONTINUED ............................................................................................ 15
3.5 I
2
C TIMING CHARACTERIZATION ............................................................................................................ 16
3.6 SPI TIMING CHARACTERIZATION (MPU-3000 ONLY) .............................................................................. 17
3.7 ABSOLUTE MAXIMUM RATINGS .............................................................................................................. 18
4 APPLICATIONS INFORMATION ............................................................................................................. 19
4.1 PIN OUT AND SIGNAL DESCRIPTION ....................................................................................................... 19
4.2 TYPICAL OPERATING CIRCUITS ............................................................................................................. 20
4.3 BILL OF MATERIALS FOR EXTERNAL COMPONENTS ................................................................................. 20
4.4 RECOMMENDED POWER-ON PROCEDURE .............................................................................................. 21
5 FUNCTIONAL OVERVIEW ....................................................................................................................... 22
5.1 BLOCK DIAGRAM .................................................................................................................................. 22
5.2 OVERVIEW ........................................................................................................................................... 22
5.3 THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING .................................. 22
5.4 DIGITAL MOTION PROCESSOR ............................................................................................................... 23
5.5 PRIMARY I
2
C AND SPI SERIAL COMMUNICATIONS INTERFACES ............................................................... 23
5.6 SECONDARY I
2
C SERIAL INTERFACE (FOR A THIRD-PARTY ACCELEROMETER OR OTHER SENSORS) ........... 24
5.7 INTERNAL CLOCK GENERATION ............................................................................................................. 26
5.8 CLOCK OUTPUT .................................................................................................................................... 27
5.9 SENSOR DATA REGISTERS ................................................................................................................... 27
5.10 FIFO ................................................................................................................................................... 27
5.11 INTERRUPTS ......................................................................................................................................... 27
5.12 DIGITAL-OUTPUT TEMPERATURE SENSOR ............................................................................................. 27
5.13 BIAS AND LDO ..................................................................................................................................... 27
5.14 CHARGE PUMP ..................................................................................................................................... 27
5.15 CHIP VERSION ...................................................................................................................................... 27
6 DIGITAL INTERFACE ............................................................................................................................... 28
6.1 I
2
C AND SPI (MPU-3000 ONLY) SERIAL INTERFACES ............................................................................. 28
7 SERIAL INTERFACE CONSIDERATIONS (MPU-3050) ......................................................................... 33
7.1 MPU-3050 SUPPORTED INTERFACES ................................................................................................... 33
MPU-3000/MPU-3050 Product Specification
Document Number: PS-MPU-3000A-00
Revision: 2.9
Release Date: 11/14/2011
3 of 47
7.2 LOGIC LEVELS ...................................................................................................................................... 33
8 ASSEMBLY ............................................................................................................................................... 36
8.1 ORIENTATION OF AXES ......................................................................................................................... 36
8.2 PACKAGE DIMENSIONS: ........................................................................................................................ 37
8.3 PCB DESIGN GUIDELINES:.................................................................................................................... 38
8.4 ASSEMBLY PRECAUTIONS ..................................................................................................................... 39
8.5 PACKAGE MARKING SPECIFICATION ...................................................................................................... 42
8.6 TAPE & REEL SPECIFICATION ................................................................................................................ 43
8.7 LABEL .................................................................................................................................................. 44
8.8 PACKAGING .......................................................................................................................................... 45
9 RELIABILITY ............................................................................................................................................ 46
9.1 QUALIFICATION TEST POLICY ................................................................................................................ 46
9.2 QUALIFICATION TEST PLAN ................................................................................................................... 46
10 ENVIRONMENTAL COMPLIANCE ...................................................................................................... 47
MPU-3000/MPU-3050 Product Specification
Document Number: PS-MPU-3000A-00
Revision: 2.9
Release Date: 11/14/2011
4 of 47
1 Document Information
1.1 Revision History
Revision
Date
Revision
Description
06/25/09
1.0
Initial Release
09/28/09
2.0
Changes for revision level compliance of MPU-30X0 to MPU-3000
Specification:
Sec. 1.2 Added Revision B1 silicon note
Sec. 1.3 Updated noise specification to 0.03º/s/√Hz
Sec. 2.3 Added secondary I
2
C interface
Sec. 3.1 Updated sensor specifications table
Sec. 3.2 Changed VDD to 2.5V and T
A
= 25
0
C
Sec. 3.2-3.3 Changed electrical specifications table format and typical values
Sec. 4.1 Updated pin-out and signal descriptions with new diagram
Sec. 4.2 Updated typical operating circuit diagram
Sec. 5.1 Updated new block diagram descriptions for primary and
secondary I
2
C serial interfaces
Sec. 5.9 Changed FIFO description
Sec. 6 Edited digital interface
Sec. 10.2 Updated package drawing/dimensions
Sec. 10.7 Edited trace routing
Sec. 13 Added Appendix 1.0, Errata for Revision G devices
11/5/09
2.1
Sec. 10 Added Material Handling Specification content
12/23/09
2.2
Sec. 3.2 Updated Electrical Specifications with Power-Supply Ramp Rate
for VLOGIC Reference Voltage
Sec. 3.3 Updated Level Output Current specifications for the Primary and
Secondary I
2
C interfaces
Sec. 3.4 Updated Frequency Variation Over Temperature Specification
for Internal Clock Source
Sec. 3.5.1 Updated ESD Specification
Sec. 4.4 Added recommended Power-On Procedure diagram
03/15/2010
2.3
Sec. 1.4 Added new InvenSense trademarks under Applications
Sec. 2.2 Edited Digital Output for 400KHz standard (not up to)
Sec. 3.1 Changed Sensitivity Scale Factor to 115 LSB/(º/s)
Sec. 4.4 Updated Recommended Power-on Procedure diagram
Sec. 8.2 Modified Example Power Configuration diagram to remove IME-
3000 reference
Sec. 11.2 Updated ESD-HBM for Device Component Level Tests.
Removed all references to IME-3000 and replaced with third-
party accelerometer.
08/17/2010
2.4
Sec. 3.1 Updated sensitivity scale factor, ZRO, Noise performance
Sec. 3.2 Added operating current for case without DMP
Added start-up time
Sec. 8.2 Updated table with reference to AUX_VDDIO
Sec. 9.1 Added Demo Software Section
Sec. 10-11 Added Register Maps and Register Description Sections
Sec. 12.9 Updated table and accompanying text
Sec. 12.11 Added Storage Specifications Section
Sec. 14 Added Environment Compliance Section
08/26/2010
2.4b
Sec. 3.2-3.3 Updated specifications for C
i
Sec. 3.5 Updated specifications for C
b
Sec. 3.3 Updated V
IH
and V
hys
MPU-3000/MPU-3050 Product Specification
Document Number: PS-MPU-3000A-00
Revision: 2.9
Release Date: 11/14/2011
5 of 47
Revision
Date
Revision
Description
12/23/2010
2.5
Sec. 9 Removed MPL section. Created a separate document for
Register Information
03/03/2011
2.6
Sec. 2.2 Clarified SPI Usage case
Sec. 4.3 Fixed C1 and C2 Specifications
Sec. 5.5 Clarified SPI Usage case
Sec. 5.5 Documented inoperable primary bus when VDD is low and
interface pins are low impedance
Sec. 5.6 Documented gyro access capability in Pass-Through Mode
Sec. 5.6 Documented the Secondary I
2
C bus Internal Pull Up
configuration
Sec. 7.2 Modified diagrams to clarify usage of 3
rd
party accelerometers
Sec. 8 Modified assembly rules and Moisture Sensitivity Level (MSL)
Labels
05/19/2011
2.7
Sec. 1.2 Updated Software References
Sec. 1.4 Added section describing InvenSense software solutions
Sec. 3.2 Clarified Digital Input and Digital Output specifications
Sec. 3.2 Added CLKOUT Digital Out Specifications
Sec. 4.4 Clarified T
VLG-VDD
value
Sec. 5.6 Modified diagrams for clarity
Sec. 8.4.3 Clarified Trace Routing precautions
Sec. 8.5 Modified Package Marking diagrams for clarity
Sec. 8.8 Updated packaging images
06/13/2011
2.8
Sec. 3.5 Specified I
2
C Timing Specifications as only for the Primary I
2
C
bus. Added reference to App Note for details regarding the
Auxiliary I
2
C bus specifications.
Sec. 4.1 Specified CLKIN and FSYNC to be connected to GND if unused.
Sec. 4.4 Modified T
VDDR
value for consistency with Electrical
Characteristics. Modified Power Up Sequencing Notes for clarity
11/14/2011
2.9
Sec. 3.7 Updated absolute maximum rating for acceleration
Sec. 8.5 Updated package marking description