Technical Program Manager (TPM), Image Sensor, Japan
Tokyo, Tokyo-to, Japan
Hardware
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Technical Program Managers take the lead in driving technical, operational, and quality issues related to custom semiconductor devices in key Japanese image sensor vendors. The role will be the onsite DRI for and act as a liaison between the vendor and global Apple teams.
Operations engineering is engaged from the earliest stages of new product introduction, engineering builds, ramp up and throughout product lifecycle. You will ensure high quality and high yield, working with module and sensor teams to quickly resolve technical and operational issues and interface between sensor vendors and downstream module integrators.
Areas of coverage will be in the wafer processing of logic + pixel wafer, process integration, wafer test, wafer backend, and product engineering analysis.
This role will cover image sensors, but occasional support of other Japan semiconductor vendors will be required.
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Description
- On site – Technical Operations owner for MP readiness of NPI, Ramp, and Sustaining areas of assigned image sensor products
- Approve vendor process flow, process quality control plan (tests, methods, sample sizes, pass /fail criteria), equipment list, and Cosmetic specs (Ensure cosmetic standards are aligned with Module integrators) for production readiness
- Conduct site quality and process audits for Mass production readiness
- Contribute to mass production release reviews and verify that all we are ready to ramp
- In mass production, lead resolution of device related quality issues in wafer fab, back-end processing, transit, and module integrator
- Set a vision for constant product quality and operational improvement year over year. Set daring targets and drive plans to achieve
- Be involved at product concept to ensure products are designed for manufacturing (DFM). Build in constant design improvement for product quality, factory efficiency and product cost
- Manage new process introduction and special projects, such as new testers
- Ensure device vendors are conforming to Apple specs and requirements
- Ensure timely test correlation activities and close test gaps between device, module, and system
- Supervise and report yield, manufacturing metrics (CpK, FMEA etc.). Drive improvement programs as appropriate
- Drive FACA for sensor related returns from integrators, field returns, and EFFA issues. Track, report and close out issues in a timely manner
- Ensure 8D reports and PCNs are maintained accurately
- Raise and balance formal company-wide Quality Alerts
- Organize three-way meetings with device vendors and module integrators to get feedback on downstream issues and to ensure smooth co-working. Assist and arbitrate as needed
- Manage the quality relationship with image sensor vendors. This involves regular face to face reviews, efficient vendor reporting systems and audits
- Ensure qualification and reliability activities at vendors are in line with requirements
- Regularly provide status reporting updates to executives and escalation when needed
- Teamwork: constant interfacing with multiple functional teams across Apple and its suppliers
- Work with internal Supplier Quality Engineers at module integrators
- Close coordination with device design team, module design team and NPI project managers
- Interface with reliability engineering and system quality engineers
Minimum Qualifications
- BS/MS or equivalent experience in Electrical Engineering, Material Engineering, or allied technical subject
- 5+ Years’ experience in image sensor engineering fields (Process Eng, Process integration engineering, or Product engineering)
- In-depth understanding of wafer test, yield, wafer fab process integration, wafer packaging, back-end issues
- Familiarity with wafer fab quality systems and in line process quality control. Ability to audit and approve vendor process, process flow and equipment for new devices
- Working proficiency of the English and Japanese language
Key Qualifications
Preferred Qualifications
- 10+ years proven experience in image sensor devices/systems
- Solid understanding of image sensor technology, performance metrics, sensor usage, test, and integration into module and camera system is preferred
- Experience with external vendor, supplier, or foundry management
- Interpersonal skills of leadership, project management, communication, collaboration, influencing and negotiation
- Strong technical skills, involving problem solving and issue root causing in a pressured environment
- Flexibility for within Japan travel (30%) + International Travel (< 5%). Evening and weekends work will be needed